Patent · US Expired

Semiconductor device with a recessed bond pad

US7408241B2 · kind B2 · utility

2Cited by

8References

19Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Michael Bauer · Nittendorf, DE
Irmgard Escher-Poeppel · Regensburg, DE
Edward Fuergut · Nuremberg, DE
Simon Jerebic · Regensburg, DE
Holger Woerner · Regensburg, DE

Key dates

Filing date	Feb 7, 2006
Grant date	Aug 5, 2008
Priority date	—
Expiry date	May 4, 2026

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY02P70/50
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor device with surface-mountable outer contacts and to a process for producing it is disclosed. In one embodiment, surface-mountable outer contacts are arranged on outer contact connection surfaces on the underside of the semiconductor device. In their respective center region, the outer contact connection surfaces have at least one recess which has a dovetail-like profile, the areal extent of the recess being smaller than the maximum cross section of an outer contact. In a one process, the recess in the center region is achieved by selective deposition of correspondingly patterned metal layers.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.