Leonard Gardecki
7Patents
3h-index
24Co-inventors
53Inventor score
Filing activity: Oct 30, 1996 → May 8, 2008
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6706621B2 | Wafer integrated rigid support ring | Electricity | 25 | Expired |
| US7670437B2 | Mask and substrate alignment for solder bump process | Electricity | 5 | Active |
| US7288492B2 | Method for forming interconnects on thin wafers | Electricity | 5 | Expired |
| US7138326B2 | Wafer integrated rigid support ring | Electricity | 1 | Expired |
| US6951775B2 | Method for forming interconnects on thin wafers | Electricity | 1 | Expired |
| US5895312A | Apparatus for removing surface irregularities from a flat workpiece | Electricity | 1 | Expired |
| US7410919B2 | Mask and substrate alignment for solder bump process | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.