Semiconductor chip assembly with metal containment wall and solder terminal
US7414319B2 · kind B2 · utility
8Cited by
155References
100Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 26, 2005 |
| Grant date | Aug 19, 2008 |
| Priority date | — |
| Expiry date | Nov 17, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line, a metal containment wall and a solder terminal, and a connection joint that electrically connects the routing line and the pad. The metal containment wall includes a cavity, and the solder terminal contacts the metal containment wall in the cavity and is spaced from the routing line.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.