Method and apparatus for measuring temperature of substrate
US7416330B2 · kind B2 · utility
4Cited by
15References
8Claims
0Family size
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Key dates
| Filing date | Aug 4, 2005 |
| Grant date | Aug 26, 2008 |
| Priority date | — |
| Expiry date | Feb 5, 2026 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01K11/12
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The temperature of the surface and/or inside of a substrate is measured by irradiating the front surface or rear surface of the substrate, whose temperature is to be measured, with light and measuring the interference of a reflected light from the substrate and a reference light. A method and apparatus for measuring temperature or thickness which is suitable for directly measuring the temperature of the outermost surface layer of a substrate, and an apparatus for treating a substrate for an electronic device, which uses such method, are provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.