Patent · US Expired

Plasma processing apparatus

US7416633B2 · kind B2 · utility

4Cited by
0References
3Claims
0Family size

Assignee

Inventors

Key dates

Filing dateAug 30, 2004
Grant dateAug 26, 2008
Priority date
Expiry dateAug 15, 2025

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10S156/916
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

Described is a vacuum processing apparatus that includes a vacuum container which has a processing chamber inside thereof, wherein a plasma used for processing a sample is formed inside the processing chamber. The processing chamber has an upper side wall which surrounds a space in which the plasma is formed and contacts the plasma, and a lower side wall inside of which a sample stand, supporting the sample to be processed, is arranged. A connecting portion is provided between the upper and lower side walls, and a heater is provided for heating the upper side wall. The apparatus also includes structure at the connecting portion to impede heat transfer between the upper and lower side walls.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.