Compositions and methods for rapidly removing overfilled substrates
US7419911B2 · kind B2 · utility
19Cited by
44References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 10, 2004 |
| Grant date | Sep 2, 2008 |
| Priority date | — |
| Expiry date | Jul 3, 2025 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23F3/06
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
This invention relates to compositions and methods for removing overfilled substrates, preferably at a relatively high removal rates. Advantageously, a composition according to the invention can contain an oxidizer, preferably a per-type oxidizer such as a peroxide, periodic acid, and peracetic acid, and may also optionally contain an abrasive.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.