Conductive polishing article for electrochemical mechanical polishing

US7422516B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Paul D. Butterfield · San Jose, US
• Liang-Yuh Chen · San Jose, US
• Yonqi Hu · San Jose, US
• Antoine P. Manens · Palo Alto, US
• Rashid Mavliev · Truckee, US
• Stan Tsai · Clifton Park, US
• Feng Q. Liu · San Jose, US
• Ralph Wadensweiler · Sunnyvale, US
• Lizhong Sun · San Jose, US
• Siew Neo · Sunnyvale, US
• Alain Duboust · Sunnyvale, US

Key dates

• Filing date: Oct 8, 2007
• Grant date: Sep 9, 2008
• Expiry date: Oct 8, 2027

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/32125
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

Embodiments of a polishing article for polishing a substrate are provided. In one embodiment, the polishing article includes an annular upper layer made of a dielectric material coupled to an annular lower layer made of a conductive material, and an annular subpad sandwiched between the annular upper layer and the annular lower layer forming a replaceable assembly therewith.