Method for making flip chip on leadframe package
US7425468B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 12, 2006 |
| Grant date | Sep 16, 2008 |
| Priority date | — |
| Expiry date | Dec 12, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01322
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A flip chip on leadframe package and manufacturing method includes providing a leadframe having a plurality of inner leads; providing a chip having an active surface; forming a plurality of first bumps and at least one second bump on the active surface, the material of the first bumps is the same as the second bump, and the height of the second bump is lower than the first bumps; dipping the top of the first bumps in a flux, so that the second bump is not dipped with the flux; contacting the first bumps to the corresponding inner leads; proceeding with a reflow so that the first bumps are melted and connected to the corresponding inner leads, and the second bump is connected to the corresponding inner lead without being melted, to maintain a gap between the chip and the inner leads to prevent collapse of the first bumps.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.