Semiconductor stack block comprising semiconductor chips and methods for producing the same

US7429782B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Markus Brunnbauer · Lappersdorf, DE
• Edward Fuergut · Nuremberg, DE

Key dates

• Filing date: Jun 28, 2006
• Grant date: Sep 30, 2008
• Expiry date: Jul 19, 2026

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/0002
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A semiconductor stack block contains either stacked semiconductor chip size semiconductor devices or semiconductor devices with semiconductor chips in a plastic housing composition, the semiconductor chips and the plastic housing composition having a coplanar area. Arranged on the active top side of the semiconductor chips and the plastic housing composition is an areal wiring structure, by which device interconnects are led to an individual edge of the semiconductor devices. The edges with the ends of the device interconnects form the underside of the semiconductor stack block, external contact areas being arranged on the ends of the device interconnects, the external contact areas carrying external contacts.