Inventor · Lappersdorf, DE

Markus Brunnbauer

56Patents

14h-index

52Co-inventors

83Inventor score

Filing activity: May 24, 2006 → May 1, 2018

Most-cited inventions

Patent	Title	Area	Cited by	Status
US7834464B2	Semiconductor chip package, semiconductor chip assembly, and method for fabricating a device	Electricity	73	Active
US7759163B2	Semiconductor module	Electricity	35	Active
US7906860B2	Semiconductor device	Electricity	32	Active
US8829663B2	Stackable semiconductor package with encapsulant and electrically conductive feed-through	Electricity	32	Active
US8202763B2	Semiconductor chip package, semiconductor chip assembly, and method for fabricating a device	Electricity	22	Active
US7687895B2	Workpiece with semiconductor chips and molding, semiconductor device and method for producing a workpiece with semiconductors chips	Electricity	21	Active
US8012807B2	Method for producing chip packages, and chip package produced in this way	Electricity	21	Active
US8330273B2	Semiconductor device including molding compound layer forms a common plane with the surface of the semiconductor chip	Electricity	20	Active
US8106497B2	Semiconductor module having a semiconductor chip stack and method	Electricity	20	Active
US8093711B2	Semiconductor device	Electricity	20	Active
US7943423B2	Reconfigured wafer alignment	Electricity	20	Active
US7732242B2	Composite board with semiconductor chips and plastic housing composition and method	Electricity	18	Active
US7863088B2	Semiconductor device including covering a semiconductor with a molding compound and forming a through hole in the molding compound	Electricity	17	Active
US8178953B2	On-chip RF shields with front side redistribution lines	Electricity	17	Active
US7429782B2	Semiconductor stack block comprising semiconductor chips and methods for producing the same	Electricity	14	Active
US8063469B2	On-chip radio frequency shield with interconnect metallization	Electricity	10	Active
US7592689B2	Semiconductor module comprising semiconductor chips and method for producing the same	Emerging Cross-Sectional Technologies	8	Active
US8309454B2	Structure for electrostatic discharge in embedded wafer level packages	Electricity	8	Active
US8188585B2	Electronic device and method for producing a device	Electricity	8	Active
US8471393B2	Semiconductor component including a semiconductor chip and a passive component	Electricity	6	Active
US7843055B2	Semiconductor device having an adhesion promoting layer and method for producing it	Emerging Cross-Sectional Technologies	6	Active
US8080880B2	Semiconductor device with arrangement of parallel conductor lines being insulated, between and orthogonal to external contact pads	Electricity	5	Active
US9293423B2	Workpiece with semiconductor chips, semiconductor device and method for producing a workpiece with semiconductor chips	Electricity	5	Active
US7674654B2	Producing thin integrated semiconductor devices	Electricity	5	Active
US7911068B2	Component and method for producing a component	Electricity	5	Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.