Thin multichip flex-module
US7429788B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 7, 2007 |
| Grant date | Sep 30, 2008 |
| Priority date | — |
| Expiry date | Mar 7, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/2018
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A thin multichip module comprises: a foldable frame comprising two rigid, substantially planar members capable of being folded together about a selected fold axis to form a substantially closed structure; a flex circuit having a plurality of integrated circuit chips disposed thereon, the flex circuit bonded to at least one of the planar members over at least a portion of each of their respective surfaces; and, electrodes on the module configured to be accessible to an external socket after the frame is closed. A method for making a thin multichip module comprises the steps of: a. attaching integrated circuit chips to a flex circuit; b. bonding the flex circuit to a foldable frame comprising two rigid, substantially planar members capable of being folded together about a selected fold axis to form a substantially closed structure; and, c. folding the frame approximately 180° about the fold axis.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.