Patent assignee · US · COMPANY

Microelectronics Assembly Technologies, Inc.

18Patents
18Active
18Granted
48Portfolio score

Filing activity: Mar 7, 2007 → Feb 27, 2015 · 10 expiring within 5 years

Most-cited patents

PatentTitleAreaCited byStatus
US7796399B2 Thin multi-chip flex module Emerging Cross-Sectional Technologies 93 Active
US7393226B2 Thin multichip flex-module Electricity 32 Active
US7394149B2 Thin multichip flex-module Electricity 19 Active
US7429788B2 Thin multichip flex-module Electricity 17 Active
US7724530B2 Thin multi-chip flex module Emerging Cross-Sectional Technologies 15 Active
US7787254B2 Thin multichip flex-module Electricity 14 Active
US8899994B2 Compression connector system Electricity 13 Active
US7520781B2 Thin multichip flex-module Electricity 13 Active
US8559181B2 Thin multi-chip flex module Emerging Cross-Sectional Technologies 10 Active
US8837141B2 Electronic module with heat spreading enclosure Emerging Cross-Sectional Technologies 6 Active
US8817458B2 Flexible circuit board and connection system Electricity 5 Active
US8834182B2 Pierced flexible circuit and compression joint Emerging Cross-Sectional Technologies 5 Active
USRE42252E1 Thin multi-chip flex module General 5 Active
US9746879B2 Rigid circuit board with flexibly attached module Electricity 5 Active
US8692124B2 Electrical connector and method of making Emerging Cross-Sectional Technologies 4 Active
US8345431B2 Thin multi-chip flex module Emerging Cross-Sectional Technologies 2 Active
US9338895B2 Method for making an electrical circuit Emerging Cross-Sectional Technologies 2 Active
US8902606B2 Electronic interconnect system Physics 1 Active

Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.