Electrostatic chuck for wafer metrology and inspection equipment
US7430104B2 · kind B2 · utility
5Cited by
21References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 29, 2003 |
| Grant date | Sep 30, 2008 |
| Priority date | — |
| Expiry date | Jul 25, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T279/1208
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electrostatic chuck is configured for electrostatically securing a wafer while limiting charge on the wafer and physical contact between the electrostatic chuck and the wafer. The electrostatic chuck has a pair of electrodes and at least one support pin electrically isolated from the electrodes. The top portion of the support pin protrudes above the top surface of the electrodes. The support pin can be such that the top portion of the support pin is adjustable with respect to the top surfaces of the electrodes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.