Plasma confinement ring assemblies having reduced polymer deposition characteristics
US7430986B2 · kind B2 · utility
18Cited by
35References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 18, 2005 |
| Grant date | Oct 7, 2008 |
| Priority date | — |
| Expiry date | Feb 5, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S156/915
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Plasma confinement ring assemblies are provided that include confinement rings adapted to reach sufficiently high temperatures on plasma-exposed surfaces of the rings to avoid polymer deposition on those surfaces. The plasma confinement rings include thermal chokes adapted to localize heating at selected portions of the rings that include the plasma exposed surfaces. The thermal chokes reduce heat conduction from those portions to other portions of the rings, which causes selected portions of the rings to reach desired temperatures during plasma processing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.