Integrated circuit package system including ribbon bond interconnect
US7443018B2 · kind B2 · utility
1Cited by
10References
20Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Nov 9, 2005 |
| Grant date | Oct 28, 2008 |
| Priority date | — |
| Expiry date | Nov 9, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/2076
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit package system including a ribbon bond interconnect is provided, having a semiconductor device with at least one pad thereon. An external connection is provided. A heavy ribbon is provided and bonded to the external connection and to the pad on the semiconductor device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.