Inventor · Singapore, SG

You Yang Ong

14Patents

5h-index

15Co-inventors

55Inventor score

Filing activity: Oct 13, 2005 → Apr 3, 2012

Most-cited inventions

Patent	Title	Area	Cited by	Status
US7535086B2	Integrated circuit package-on-package stacking system	Electricity	18	Active
US8163604B2	Integrated circuit package system using etched leadframe	Electricity	9	Active
US7598600B2	Stackable power semiconductor package system	Electricity	8	Active
US8546929B2	Embedded integrated circuit package-on-package system	Electricity	7	Active
US7859098B2	Embedded integrated circuit package system	Electricity	6	Active
US8164182B2	Hyper thermally enhanced semiconductor package system comprising heat slugs on opposite surfaces of a semiconductor chip	Electricity	5	Expired
US7557432B2	Thermally enhanced power semiconductor package system	Electricity	4	Active
US7718472B2	Integrated circuit package-on-package stacking system and method of manufacture thereof	Electricity	3	Active
US8093694B2	Method of manufacturing non-leaded integrated circuit package system having etched differential height lead structures	Electricity	3	Active
US8803299B2	Stacked integrated circuit package system	Electricity	2	Active
US7868434B2	Integrated circuit package-on-package stacking system	Electricity	2	Active
US7443018B2	Integrated circuit package system including ribbon bond interconnect	Electricity	1	Expired
US8415786B2	Thermally enhanced semiconductor package system	Electricity	0	Active
US8067832B2	Embedded integrated circuit package system and method of manufacture thereof	Electricity	0	Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.