Semiconductor chip assembly with welded metal pillar of stacked metal balls
US7446419B1 · kind B1 · utility
29Cited by
147References
150Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 26, 2006 |
| Grant date | Nov 4, 2008 |
| Priority date | — |
| Expiry date | Apr 3, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3512
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line and a metal pillar, a connection joint that electrically connects the routing line and the pad, and an encapsulant. The chip and the metal pillar are embedded in the encapsulant, the routing line extends laterally beyond the metal pillar towards the chip, and the metal pillar is welded to the routing line and includes stacked metal balls that are welded together.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.