Selectively accelerated plating of metal features
US7449099B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 21, 2004 |
| Grant date | Nov 11, 2008 |
| Priority date | — |
| Expiry date | May 21, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/122
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
To make a metal feature, a non-plateable layer is applied to a workpiece surface and then patterned to form a first plating region and a first non-plating region. Then, metal is deposited on the workpiece to form a raised field region in said first plating region and a recessed region in said first non-plating region. Then, an accelerator film is applied globally on the workpiece. A portion of the accelerator film is selectively removed from the field region, and another portion of the accelerator film remains in the recessed acceleration region. Then, metal is deposited onto the workpiece, and the metal deposits at an accelerated rate in the acceleration region, resulting in a greater thickness of metal in the acceleration region compared to metal in the non-activated field region. Then, metal is completely removed from the field region, thereby forming the metal feature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.