Method of making a conformal electromagnetic interference shield
US7451539B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 8, 2005 |
| Grant date | Nov 18, 2008 |
| Priority date | — |
| Expiry date | Apr 30, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49144
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An electromagnetic shield for an electronic module includes a surface finish that is applied to the surface of an electronic module so as to minimize the size of the shield. Once the shield is in place, the shield acts to address electromagnetic interference (EMI) concerns associated with the electronic module. An electronic module having a ring of conductive material embedded about its peripheral edge is formed. The electronic module is then sub-diced so as to expose the ring of conductive material. After sub-dicing, a conductive material may be applied through an electroless plating process followed by an electrolytic plating process. Alternatively, a conductive epoxy may be sprayed or painted onto the surface of the electronic module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.