Method and apparatus for wafer cleaning
US7451774B2 · kind B2 · utility
3Cited by
20References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 25, 2001 |
| Grant date | Nov 18, 2008 |
| Priority date | — |
| Expiry date | Jan 16, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S134/902
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
An apparatus for wet processing individual wafers comprising; a means for holding the wafer; a means for providing acoustic energy to a non-device side of the wafer; and a means for flowing a fluid onto a device side of the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.