Method of increasing the area of a useful layer of material transferred onto a support
US7452584B2 · kind B2 · utility
5Cited by
6References
16Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 7, 2006 |
| Grant date | Nov 18, 2008 |
| Priority date | — |
| Expiry date | Sep 20, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/219
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A composite structure in accordance with the invention includes front faces of first and second substrates that are molecularly bonded to each other, wherein the dimensions of the second substrate outline are larger than the first substrate outline. The front faces are molecularly bonded such that the outline of the first front face is disposed at least partially within the outline of the second front face. A peripheral ring extends around the first front face and facing the first substrate, in which bonding between the front faces is weak or absent, and has a maximum width of less than about 0.5 mm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.