Semiconductor package with contact support layer and method to produce the package
US7452747B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 10, 2006 |
| Grant date | Nov 18, 2008 |
| Priority date | — |
| Expiry date | Sep 21, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package comprises a substrate which includes a plurality of conducting traces and upper contact areas on its upper surface and a second plurality of lower conductive traces and external contact areas on its bottom surface and external conducting members attached to the external contact areas. The semiconductor package also includes a semiconductor die comprising an active surface with a plurality of die contact pads, electrically connected to the contact areas of the substrate by conducting members. A support layer between the conducting members on the active surface of the semiconductor die covers at least the base portion of the conducting members. A method relates to the production of the semiconductor package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.