Patent · US Active

Capacitor attachment method

US7452750B2 · kind B2 · utility

7Cited by

5References

20Claims

0Family size

Assignee

Freeescale Semiconductor, Inc. · US

Inventors

Wai Yew Lo · Petaling Jaya, MY
Chee Seng Foong · Bandar Baru Sungai Buloh, MY

Key dates

Filing date	Feb 28, 2006
Grant date	Nov 18, 2008
Priority date	—
Expiry date	Nov 24, 2026

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY02P70/50
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A method of attaching a capacitor (112) to a substrate (100) includes applying a flux (108) to respective capacitor pads (104, 106) on the substrate (100). The capacitor (112) is placed on the fluxed capacitor pads (104, 106) and a reflow operation is performed on the capacitor (112) and the substrate (100) such that intermetallic interconnects (128) are formed between the capacitor (112) and the substrate (100).

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.