Gas distribution showerhead featuring exhaust apertures
US7452827B2 · kind B2 · utility
25Cited by
24References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 13, 2006 |
| Grant date | Nov 18, 2008 |
| Priority date | — |
| Expiry date | Dec 15, 2026 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/45565
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method of processing a semiconductor workpiece. The method includes flowing a process gas to a semiconductor workpiece through a first plurality of orifices positioned in a gas distribution faceplate. The method also includes removing gas from over the semiconductor workpiece through a chamber exhaust port and a second plurality of orifices positioned in the gas distribution faceplate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.