High power MCM package with improved planarity and heat dissipation
US7453146B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 1, 2005 |
| Grant date | Nov 18, 2008 |
| Priority date | — |
| Expiry date | Jun 5, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A structure and a manufacturing method providing improved coplanarity accommodation and heat dissipation in a multi-chip module. One of the components in a multi-chip module (MCM) is provided with a recess formed in its respective top surface; and a film is applied so as to cover the top surfaces of the components and so that any excess film can enter into the recess. The recess is preferably a peripheral groove. Then when molding material is injected, it may surround and seal the side surfaces of the components, while not substantially covering the top surfaces that are covered by the film. Since the recess receives any excess film material that may be present, it may prevent such excess film material from covering the respective side surfaces of the corresponding component and creating a void between the component and the molding material. This advantageous effect of the invention is particularly useful when the top component surface in which the recess is formed is higher above the circuit substrate than the respective top surface of another one of the components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.