Patent · US Active

Method of and system for monitoring the functionality of a wafer probe site

US7453261B1 · kind B1 · utility

11Cited by
6References
20Claims
0Family size

Assignee

Inventor

Key dates

Filing dateOct 27, 2006
Grant dateNov 18, 2008
Priority date—
Expiry dateDec 6, 2026

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG01R35/00
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

A method of monitoring the functionality of a wafer probe is disclosed. The method comprises applying a multi-site probe to a plurality of semiconductor dies; comparing the failure rate of a first probe site of the multi-site probe with the failure rate of a second probe site of the multi-site probe for a test of the plurality of semiconductor dies; and determining that a probe site of the multi-site probe is defective based upon comparing the failure rate of the first probe site of the multi-site probe with the failure rate of the second probe site of the multi-site probe. A system for monitoring the functionality of a wafer probe site is disclosed.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.