Integrated circuit chip and integrated device

US7456505B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Minka Gospodinova · Birkenfeld, DE
• Jochen Thomas · Munich, DE
• Dominique Savignac · Ismaning, DE

Key dates

• Filing date: Jul 29, 2005
• Grant date: Nov 25, 2008
• Expiry date: Dec 12, 2025

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/3011
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Embodiments provide for integrated circuit chip and device having such an integrated circuit, in which different types of pads are arranged in separate rows. In one embodiment the pads are arranged to reduce the loop inductance of corresponding signal and power supply bond wires.