Flip chip bonding tool
US7458495B2 · kind B2 · utility
4Cited by
2References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 13, 2004 |
| Grant date | Dec 2, 2008 |
| Priority date | — |
| Expiry date | Aug 20, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A bonding tool and method for bonding a semiconductor chip to a surface is provided wherein the bonding tool includes a bonding tip comprising a ceramic material, preferably titanium carbide. The bonding tip is operative to hold the chip and a bonding energy generator such as an ultrasonic transducer is coupled to the bonding tip for applying bonding energy to the bonding tip and the chip to bond the chip to the surface. The bonding tip may further include martensite such that the titanium carbide is present in a hard phase and the martensite is present in a soft phase as a binder for the same.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.