Standoffs for centralizing internals in packaging process
US7459797B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 1, 2004 |
| Grant date | Dec 2, 2008 |
| Priority date | — |
| Expiry date | Sep 1, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device, semiconductor die package, mold tooling, and methods of fabricating the device and packages are provided. In one embodiment, the semiconductor device comprises a pair of semiconductor dies mounted on opposing sides of a flexible tape substrate, the outer surfaces of the dies having one or more standoffs disposed thereon. The standoffs can be brought into contact with an inner surface of the mold plates of a mold tooling when the device is positioned between the mold plates to maintain the flexible tape substrate in a centralized position within a mold chamber and inhibit the tape from bending as a molding compound flows into the chamber during encapsulation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.