Method and apparatus for selecting wafers for sampling
US7460968B1 · kind B1 · utility
9Cited by
1References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 30, 2005 |
| Grant date | Dec 2, 2008 |
| Priority date | — |
| Expiry date | Sep 30, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P90/02
- WIPO fieldIT methods for management
- WIPO sectorElectrical engineering
Abstract
The present invention provides a method and apparatus for selecting wafers for sampling. The method includes determining a plurality of sampling rules associated with at least one of a plurality of wafers and selecting at least one wafer for sampling based on the plurality of sampling rules.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.