Leadframe comprising tin plating or an intermetallic layer formed therefrom
US7462926B2 · kind B2 · utility
4Cited by
5References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 1, 2005 |
| Grant date | Dec 9, 2008 |
| Priority date | — |
| Expiry date | Mar 14, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12903
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of producing a leadframe is provided, the method including the steps of providing a substrate, plating the substrate with a layer of tin, plating a layer of nickel over the layer of tin, and thereafter plating one or more protective layers over the layer of nickel. The leadframe may thereafter be heated to produce one or more intermetallic layers comprising tin, which impedes the out-diffusion of copper from a base material of the leadframe to the surface thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.