Stackable micropackages and stacked modules
US7468553B2 · kind B2 · utility
9Cited by
373References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 6, 2007 |
| Grant date | Dec 23, 2008 |
| Priority date | — |
| Expiry date | May 22, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides a system and method for devising stackable assemblies that may be then stacked to create a stacked circuit module. One or more integrated circuit (IC) die are disposed on one or more sides of a redistribution substrate that is preferably flexible circuitry. In some preferred embodiments, the die and redistribution substrate are bonded together and wire-bond connected. Two or more stackable assemblies are interconnected through frame members to create low profile high density stacked circuit modules.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.