Method of providing a low-stress sensor configuration for a lithography-defined read sensor
US7469465B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 30, 2004 |
| Grant date | Dec 30, 2008 |
| Priority date | — |
| Expiry date | Oct 24, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49052
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
One illustrative method of fabricating a read sensor of a magnetic head includes the steps of forming a plurality of read sensor layers on a wafer; etching the read sensor layers to form a read sensor structure with a trench in front of the read sensor structure; forming a highly porous material within the trench; and slicing the wafer and lapping the sliced wafer through the highly porous material until an air bearing surface (ABS) of the magnetic head is reached. Advantageously, the highly porous material in front of the read sensor structure reduces mechanical stress on the read sensor during the lapping process. This reduces the likelihood that the amplitude of the read sensor will be degraded or set in a “flipped” or reversed orientation, as well as reduces the likelihood that electrostatic discharge (ESD) damage to the read sensor will occur.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.