Integrated circuit having a lid and method of employing a lid on an integrated circuit
US7473583B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Jan 23, 2007 |
| Grant date | Jan 6, 2009 |
| Priority date | — |
| Expiry date | Mar 3, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19105
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention relates to a lid for an integrated circuit. According to one embodiment, an integrated circuit having a lid comprises a substrate having a flat surface and extending a first length and a lid having a recess and a foot portion. The lid generally has a second length shorter than the first length, and is positioned on the flat surface of the substrate. Finally, a bonding agent is positioned on the flat surface adjacent the foot portion of the lid. According to an alternate embodiment, a second component is positioned on the substrate outside the foot portion, and an adhesive seal is positioned on the substrate adjacent the foot and covering the component. A method of securing a lid to an integrated circuit is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.