Power semiconductor module having surface-mountable flat external contacts and method for producing the same

US7479691B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Henrik Ewe · Burglengenfeld, DE
• Stefan Landau · Usingen, DE
• Klaus Schiess · Allensbach, DE
• Robert Bergmann · Regensburg, DE

Key dates

• Filing date: Mar 16, 2006
• Grant date: Jan 20, 2009
• Expiry date: Apr 9, 2027

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/351
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A power semiconductor module having surface-mountable flat external contact areas and a method for producing the same is disclosed. In one embodiment, the top sides of the external contacts form an inner housing plane, on which at least one power semiconductor chip is fixed by its rear side on a drain external contact. An insulation layer covers the top side over the edge sides of the semiconductor chip as far as the inner housing plane whilst leaving free the source and gate contact areas on the top side of the semiconductor chip and also whilst partly leaving free the top sides of the corresponding external contacts. Arranged on the insulation layer is a connecting conductive layer between the source contact areas on the top side of the semiconductor chip and the top sides of the source external contacts, and also a gate connecting layer from the gate contact areas to the top side of the gate external contact.