Method of making conductor contacts having enhanced reliability
US7480990B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 6, 2006 |
| Grant date | Jan 27, 2009 |
| Priority date | — |
| Expiry date | Jul 26, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods for forming conductor contacts provide for etching through a capping layer located upon a conductor contact region within a substrate. A first pair of methods provide for etching through at least a lower thickness of the capping layer with other than a reactive ion etch to provide an exposed conductor contact region. A partially overlapping second pair of methods provides for converting at least an upper thickness of the capping layer to a converted material layer that is removed incident to providing an exposed conductor contact region. As adjunct to any of the methods, a liner layer is formed and located upon the exposed conductor contact region in absence of an undesirable reactive environment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.