Method for determining the impact of layer thicknesses on laminate warpage
US7482180B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 29, 2008 |
| Grant date | Jan 27, 2009 |
| Priority date | — |
| Expiry date | Apr 29, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/12
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for analyzing the warpage of organic laminates used in flip chip packages includes collecting warpage data and layer thickness data for several laminates. A principal components analysis may then be performed on the thickness data to calculate orthogonal basis vectors to re-express the thickness data in a different basis. The thickness data may then be projected onto the orthogonal basis vectors. A linear model may be generated that expresses the warpage data for each laminate in terms of the projection of corresponding thickness data onto the orthogonal basis vectors, each projection multiplied by a weight. These weights may then be analyzed to determine the contribution of each orthogonal basis vector to the variance of the warpage data. The contribution and structure of each orthogonal basis vector may then be interpreted to estimate the importance of each layer or combination of layers in contributing to the laminate warpage.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.