Method of real time dynamic CD control
US7483804B2 · kind B2 · utility
5Cited by
2References
21Claims
0Family size
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Key dates
| Filing date | Sep 29, 2006 |
| Grant date | Jan 27, 2009 |
| Priority date | — |
| Expiry date | Mar 17, 2027 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/70625
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method of real time dynamic CD control in a system for patterning resist coated wafers. The method includes lithographically patterning the resist coated wafers using predetermined exposure dose and focus settings. The method further includes obtaining CD metrology data from test areas on the patterned wafers, where different groups of test areas are selected for two or more of the patterned wafers. A CD metrology data map is constructed using the CD metrology data, adjusted exposure dose and/or focus settings are established using the CD metrology data, and additional wafers are then patterned.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.