Sputtering target fixture
US7485210B2 · kind B2 · utility
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10References
1Claims
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Assignee
Inventors
Key dates
| Filing date | Oct 7, 2004 |
| Grant date | Feb 3, 2009 |
| Priority date | — |
| Expiry date | Jan 30, 2027 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C14/35
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method and apparatus for sputter deposition. The method including: providing a sputter target having a back surface and an exposed front surface; providing a source of magnetic field lines, the magnetic field lines extending through the sputter target from the back surface to the exposed front surface of the sputter target; providing one or more pole extenders between magnetic poles of the source of the magnetic field lines and the exposed front surface of the sputter target.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.