David C. Strippe
12Patents
6h-index
18Co-inventors
63Inventor score
Filing activity: Sep 23, 1987 → Jul 2, 2008
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5401675A | Method of depositing conductors in high aspect ratio apertures using a collimator | Electricity | 39 | Expired |
| US5529670A | Method of depositing conductors in high aspect ratio apertures under high temperature conditions | Electricity | 27 | Expired |
| US5628889A | High power capacity magnetron cathode | Electricity | 14 | Expired |
| US4791261A | Crucible for evaporation of metallic film | Chemistry; Metallurgy | 13 | Expired |
| US6245668A | Sputtered tungsten diffusion barrier for improved interconnect robustness | Electricity | 8 | Expired |
| US4876114A | Process for the self fractionation deposition of a metallic layer on a workpiece | Electricity | 7 | Expired |
| US6210541A | Process and apparatus for cold copper deposition to enhance copper plating fill | Chemistry; Metallurgy | 4 | Expired |
| US8052799B2 | By-product collecting processes for cleaning processes | Electricity | 3 | Active |
| US8969195B2 | Methods of manufacturing semiconductor devices and a semiconductor structure | Electricity | 0 | Active |
| US6838364B2 | Sputtered tungsten diffusion barrier for improved interconnect robustness | Electricity | 0 | Expired |
| US7485210B2 | Sputtering target fixture | Chemistry; Metallurgy | 0 | Active |
| US8157970B2 | Sputtering target fixture | Chemistry; Metallurgy | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.