Apparatus for supporting semiconductor devices during testing
US7486092B2 · kind B2 · utility
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17References
17Claims
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Assignee
Inventors
Key dates
| Filing date | Apr 22, 2004 |
| Grant date | Feb 3, 2009 |
| Priority date | — |
| Expiry date | Apr 22, 2024 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2886
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An apparatus supports, during a testing operation, a leadframe formed with at least one row of non-singulated semiconductor devices. The apparatus includes a main body and a leadframe support member, and the leadframe support is formed with at least one groove for receiving semiconductor devices such that in use leads extending from the semiconductor devices lie on a surface of the support member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.