Information handling system utilizing circuitized substrate with split conductive layer
US7491896B2 · kind B2 · utility
0Cited by
15References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 18, 2008 |
| Grant date | Feb 17, 2009 |
| Priority date | — |
| Expiry date | Jan 18, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49176
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An information handling system, e.g., a mainframe computer, which includes as part thereof a housing having therein an electrical assembly including a circuitized substrate which in turn includes a plurality of contiguous open segments which define facing edge portions within an electrically conductive layer to isolate separate portions of the conductive layer such that the layer can be used for different functions, e.g., as both power and ground elements, within the system. At least one electrical component is positioned on and electrically coupled to the circuitized substrate of the system's electrical assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.