Fluid delivery ring and methods for making and implementing the same
US7494550B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 23, 2005 |
| Grant date | Feb 24, 2009 |
| Priority date | — |
| Expiry date | Mar 24, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49433
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A method for rinsing a semiconductor wafer in a module utilizing a fluid delivery ring is provided. The method includes providing a process bowl having a generally circular shape bottom wall, a sidewall that extends upwardly from the bottom wall to define a cylindrical chamber, and a plurality of channels in the sidewall that extend from the bottom wall to an upper edge of the sidewall. A fluid delivery ring is attached onto the sidewall of the process bowl. Utilizing the process bowl, a plurality of supply tubes is inserted into the fluid delivery ring. The fluid delivery ring has a plurality of ring inlet and outlet pairs and a plurality of respective slots. Fluid is supplied to the supply tubes, and fluid is directed onto a surface of the semiconductor wafer defined within the process bowl.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.