Method of making a semiconductor chip assembly with thermal conductor and encapsulant grinding
US7494843B1 · kind B1 · utility
17Cited by
176References
100Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 26, 2006 |
| Grant date | Feb 24, 2009 |
| Priority date | — |
| Expiry date | Nov 12, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3651
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of making a semiconductor chip assembly includes mechanically attaching a semiconductor chip to a routing line, forming a thermal conductor on the chip, forming an encapsulant that covers the chip and the thermal conductor, grinding the encapsulant without grinding the thermal conductor or the chip and then grinding the encapsulant and the thermal conductor without grinding the chip such that the encapsulant and the thermal conductor are laterally aligned.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.