Optical die-down quad flat non-leaded package
US7495325B2 · kind B2 · utility
6Cited by
7References
27Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 5, 2006 |
| Grant date | Feb 24, 2009 |
| Priority date | — |
| Expiry date | May 5, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/00014
Abstract
An optical sensor package that includes an optical sensor die is mounted by flip chip interconnect onto a lead frame in a “die-down” orientation, that is, with the active side of the optical sensor die facing the lead frame. An opening is provided in the lead frame die paddle (pad), and light passes from outside the package through the opening in the lead frame die pad onto light collection elements on the active side of the chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.