Embrittled substrate and method for making same
US7498245B2 · kind B2 · utility
15Cited by
38References
29Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 29, 2001 |
| Grant date | Mar 3, 2009 |
| Priority date | — |
| Expiry date | May 29, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2221/68368
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
This invention relates to a substrate (1) weakened by the presence of a micro-cavities zone, the micro-cavities zone (4′) delimiting a thin layer (5) with one face (2) of the substrate (1), some or all of the gaseous species having been eliminated from the micro-cavities (4′).The invention also relates to a process for the production of such a substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.