Cleaning methods for silicon electrode assembly surface contamination removal
US7498269B2 · kind B2 · utility
5Cited by
4References
5Claims
0Family size
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Key dates
| Filing date | Jun 21, 2007 |
| Grant date | Mar 3, 2009 |
| Priority date | — |
| Expiry date | Jun 21, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S134/902
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Silicon electrode assembly decontamination cleaning methods and solutions, which control or eliminate possible chemical attacks of electrode assembly bonding materials, comprise ammonium fluoride, hydrogen peroxide, acetic acid, optionally ammonium acetate, and deionized water.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.