Semiconductor module having a coupling substrate, and methods for its production
US7498674B2 · kind B2 · utility
2Cited by
8References
14Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 15, 2006 |
| Grant date | Mar 3, 2009 |
| Priority date | — |
| Expiry date | Apr 12, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19104
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor module has a coupling substrate which is used for the internal electrical coupling of an integrated circuit on adjacent semiconductor chips. The semiconductor chips have integrated circuits and are arranged on a mount structure. The semiconductor chips are externally connected to external contacts. The coupling substrate overlaps edge areas of the adjacent semiconductor chips.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.