Optical inspection method for substrate defect detection
US7499583B2 · kind B2 · utility
8Cited by
41References
1Claims
0Family size
Assignee
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Key dates
| Filing date | May 24, 2004 |
| Grant date | Mar 3, 2009 |
| Priority date | — |
| Expiry date | Aug 29, 2025 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2021/887
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method and apparatus for inspecting the surface of articles, such as chips and wafers, for defects, includes a first phase of optically examining the complete surface of the article inspected at a relatively high speed and with a relatively low spatial resolution, and a second phase of optically examining with a relatively high spatial resolution only the suspected locations for the presence or absence of a defect therein.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.