Methods and apparatus for reducing arcing during plasma processing
US7501161B2 · kind B2 · utility
9Cited by
18References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 1, 2004 |
| Grant date | Mar 10, 2009 |
| Priority date | — |
| Expiry date | Jun 1, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/32623
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
In a first aspect, a method is provided for use during plasma processing. The first method includes the steps of (1) placing a substrate on a substrate holder of a plasma chamber; (2) positioning a cover frame adjacent and below a perimeter of the substrate; and (3) employing the cover frame to reduce arcing during plasma processing within the plasma chamber. Numerous other aspects are provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.